Polishing composition
US6193790A · kind A · utility
13Cited by
8References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 4, 1999 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | Jun 4, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition for memory hard disks, which comprises water and at least one abrasive selected from the group consisting of aluminum oxide, silicon dioxide, cerium oxide, zirconium oxide, titanium oxide, silicon nitride and manganese dioxide, and which further contains succinic acid or its salt dissolved in the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.