Flexible hermetic sealing
US6194789A · kind A · utility
16Cited by
1References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 22, 1997 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | Dec 22, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flexible hermetic sealing and method for making the same. Electronic components are coated with an adhesive such as an epoxy, and then a metallic layer consisting of gold, silver, nickel, or another metal is deposited thereon. The metal may be deposited by, for example, any well-known evaporating, sputtering or plating technique. The resultant seal is truly hermetic, and is suitable for use on individual electronic or optical components on a chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.