Printed circuit board with a multilayer integral thin-film metal resistor and method therefor
US6194990A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 1999 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | Mar 16, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin-film metal resistor (44) suitable for a multilayer printed circuit board (12), and a method for its fabrication. The resistor (44) generally has a multilayer construction, with the individual layers (34, 38) of the resistor (44) being self-aligned with each other so that a negative mutual inductance is produced that very nearly cancels out the self-inductance of each resistor layer (34, 38). As a result, the resistor (44) has a very low net parasitic inductance. In addition, the multilayer construction of the resistor (44) reduces the area of the circuit board (12) required to accommodate the resistor (44), and as a result reduces the problem of parasitic interactions with other circuit elements on other layers of the circuit board (12).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.