Semiconductor laser array stack package & method of fabrication
US6195376A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1998 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | Nov 10, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/22
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Semiconductor laser diodes or diode bars are assembled into stacks by a method which permits testing of an entire stack at once and which uses only high temperature solder. The stack includes a plurality of submounts which resemble elongated bars which are square in cross section. Laser diodes (or diode bars) are sandwiched between adjacent submounts. Each submount has an elongated mesa and the mesas are so shaped and positioned in the stack to form a set of ridges which fit into a set of grooves in a substrate. The diodes are bonded to adjacent submounts in a stack simultaneously by reflowing solder preforms (high temperature) in a reflow oven. The stack is secured in place in the grooves of the substrate by reflowing solder placed at the bottom of the grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.