Electronic component placing apparatus
US6195876A · kind A · utility
11Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 1999 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | Mar 5, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53478
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an electronic component placing apparatus, four magazines are mounted on a head, and yet electronic components are housed in each magazine. In this apparatus, by an operation of selectively inserting a suction nozzle into four insertion openings in the magazines, it is possible to load a desired electronic component on a substrate, and this component loading can be repeatedly performed until the housed components are exhausted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.