Method and apparatus for .mu.BGA removal and reattach
US6196439A · kind A · utility
16Cited by
26References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1998 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | May 29, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for attaching an electronic device to and removing an electronic device from a substrate. An electronic device pick-up and vacuum head applies a vacuum source to the electronic device for engaging, picking up and retaining the electronic device. The heat is transmitted by conduction through the structure of the device pick-up and vacuum head to the electronic device and solder for securing the electronic device on the substrate to heat the solder to its reflow temperature. The pick-up and vacuum head includes an electronic device engaging portion, a vacuum port, and a heat source engaging portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.