Apparatus for extracting chips from slots cut into a substrate
US6196775A · kind A · utility
5Cited by
13References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 1999 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | May 24, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T409/304088
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In an apparatus for extracting chips from slots cut into a substrate, a cutter having a cutting implement is mounted thereon and is adapted to cut slots into the substrate. At least one injector is positioned proximate to the cutting implement, and includes a nozzle having a nozzle tip directed at the slots such that during operation a current of gas is directed into the slots to loosen any substrate chips therefrom which were generated during the cutting operation. A vacuum apparatus is positioned proximate to the cutting apparatus for capturing and removing the substrate chips loosened by the injector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.