Method for adjusting differential thermal expansion between an electrical socket and a circuit board
US6196871A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 26, 1999 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | Apr 26, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method for adjusting differential thermal expansion between an electrical socket and a circuit board by means of secure and accurate interconnection of an adjusting device therebetween before a heating step. The adjusting device is made of an adhesive fusible material and fixed to the housing for absorbing most of the fracture stress exerted on the solder balls and for eliminating a misalignment between the electrical socket and the circuit board during the heating step. The adjusting device can be designed according to practical requirements to be a number of adjusting posts, an adjusting frame, or an adjusting chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.