Polycrystalline diamond compact cutter with improved cutting by preventing chip build up
US6196910A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1998 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | Aug 10, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23B27/143
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention discloses a new surface geometry of a polycrystalline diamond (PCD) cutter whereby large chips are prevented from forming in front of the cutter. The surface geometry includes recess(es) and/or raised region(s) that can act as chip breakers and also increase turbulence in the flow across the face of the cutter and thus increase the Heat transfer coefficient and reduce drag. PCD surface's geometric configuration is formed in the high temperature/high heat (HT/HP) process and is therefore integral with the cutter. This invention thus provides a polycrystalline cutter with improved cutting capability by preventing chip build up and enhanced heat transfer resulting in a cooler cutting edge temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.