Mass production of silicon dioxide film by liquid phase deposition method
US6197110A · kind A · utility
7Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1999 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | Apr 29, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A liquid phase deposition method of mass producing substantially uniform silicon dioxide films on wafers by forming wafer sets from at least four wafers. The wafer sets are placed in a slotted polytetrafluroethylene polymer boat wherein a proper and short distance between the front surface of a wafer and another surface is created. Finally, a substantially uniform silicon dioxide film is deposited on the wafer surfaces by contacting the wafer sets with an aqueous supersaturated silicon dioxide solution comprising a mixture of hydrofluosilicic acid and boric acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.