Method of making small gaps for small electrical/mechanical devices
US6197610A · kind A · utility
67Cited by
13References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 14, 2000 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | Jan 14, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method and system for making small gaps in a MEMS device is disclosed. The MEMS device is first made with a sacrificial layer where the gap is to reside. The device can then be assembled, including forming a protective coat surrounding the device. Once the protective coat is formed, small holes in the protective coat can be made to expose the sacrificial layer to an external environment. The holes can be formed using laser ablation. After the small holes have been made, an etchant can then be applied through the holes to remove the sacrificial layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.