Semiconductor device fabrication using adhesives
US6197618A · kind A · utility
6Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2000 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | May 4, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0665
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A temporary self-adherence of the individual components in a stack of semiconductor components is accomplished by the use of adhesive bodies either separate from the solder preforms used in the stack or included within the solder in the form of a tacky paste. The adhesive bodies may comprise relatively high-purity water, and adhesion of the adjoining parts is achieved by the surface tension of the water. During a single heating step, preferably performed in a protective, non-oxidizing atmosphere, the water is completely evaporated while the solder preforms are heated to form the desired solder joints.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.