Process for manufacture of a microcircuit board permitting limitation of the mechanical stresses transmitted to the microcircuit and board thus obtained
US6198044A · kind A · utility
3Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 1999 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | Jun 24, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a microcircuit board with a mechanical cut-out piece between the microcircuit and the board to limit stresses transmitted to the microcircuit. A blank of a network of conductors is created and the microcircuit is fixed in a container formed by shaping the blank, the microcircuit keeping the different parts of the network in position relative to each other and the module thus formed is installed in a cavity in the board by fixing the external connection areas onto the upper surface of the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.