System and method for supplying slurry to a semiconductor processing machine
US6200202A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1998 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Nov 30, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for supplying a slurry of a liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, is disclosed. The system includes a supply of slurry and a delivery subsystem operatively associated with the supply of slurry, the delivery subsystem being configured to deliver slurry to the semiconductor processing machine. The supply typically is configured to provide slurry from a location remote from the semiconductor processing machine to a location proximate the semiconductor processing machine, where the slurry at the location proximate the semiconductor processing machine is unpressurized. The delivery subsystem typically is configured to agitate slurry in the basin by flowing the slurry through the basin, thereby inhibiting the settling of suspended particles in the slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.