Superabrasive wheel with active bond
US6200208A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 1999 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Jan 7, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A straight, thin, monolithic abrasive wheel formed of hard and rigid abrasive grains and a sintered bond including a metal component and an active metal component exhibits superior stiffness. The metal component can be selected from among many sinterable metal compositions. The active metal is a metal capable of reacting to form a bond with the abrasive grains at sintering conditions and is present in an amount effective to integrate the grains and sintered bond into a grain-reinforced composite. A diamond abrasive, copper/tin/titanium sintered bond abrasive wheel is preferred. Such a wheel is useful for abrading operations in the electronics industry, such as cutting silicon wafers and alumina-titanium carbide pucks. The stiffness of the novel abrasive wheels is higher than conventional straight monolithic wheels and therefore improved cutting precision and less chipping can be attained without increase of wheel thickness and concomitant increased kerf loss.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.