Patent · US Expired

Hypereutectic aluminium-silicon alloy product for semi-solid forming

US6200396A · kind A · utility

9Cited by
6References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 7, 1999
Grant dateMar 13, 2001
Priority date
Expiry dateDec 7, 2019

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC22C21/04
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

This invention relates to a eutectic or hypereutectic aluminium-silicon alloy product suitable for thixoforming, comprising (by weight) 10 to 30% silicon and, if applicable, copper (<10%), magnesium (<3%), manganese (<2%), iron (<2%), nickel (<4%), cobalt (<3%) and other elements (<0.5% each and 1% in total), the microstructure of which is composed of primary silicon crystals, equiaxed type aluminium dendrites less than 4 mm in size and a eutectic composed of eutectic silicon grains and eutectic aluminium grains less than 4 mm in size.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.