Method of fabricating electro-mechanical devices by multilayer deposition
US6200508A · kind A · utility
27Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1997 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Oct 27, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3061
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Printing techniques are used to build three dimensional structures by depositing successive layers of the device onto a substrate. The layers and/or portions thereof are different materials, e.g., conductors and insulators, which provide the desired functional characteristics of the device. The substrate may be used only to provide a support for the printing process, in which case it will usually be removed after the device is fabricated, or may instead be a functioning part of the fabricated device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.