Integrated circuit package architecture with a variable dispensed compound and method of manufacturing the same
US6200828A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1998 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Mar 25, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC package architecture and a method of manufacturing the same are provided. By this packaging method, a molded compound is first formed, which covers the entire packaging area of the leadframe but leaving a window to expose the area where the chip is to be mounted. After the chip is mounted and wire bonded, a dispensed compound is formed the window to enclose the chip therein. The dispensing material can be variably selected by the manufacturer in accordance with actual application requirements. For instance, the dispensing material can be either a transparent material to allow the enclosed chip to be transparent to the outside, or a colored material for some prespecified identification purpose of the IC package. Moreover, the packaging method can be utilized on current types of IC packages and can be realized by using existing equipment and processes in a cost-effective manner without having to invest on new additional ones.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.