Microbridge structure and method for forming the microbridge structure
US6201243A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 20, 1998 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Jul 20, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The microbridge structure comprises a substrate layer provided with two first electrical contacts; a microstructure including a sensing area provided with two second electrical contacts; and a micro support for suspending the microstructure over and at a predetermined distance from the substrate layer. The micro support has two electrically conductive paths made of electrically conductive layers. The two electrically conductive paths connect respectively the two first electrical contacts of the substrate layer to the two second electrical contacts of the microstructure. The micro support extends generally underneath the microstructure, between the microstructure and the substrate layer. The invention also relates to a method for forming the microbridge structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.