Semiconductor device and method for manufacturing the same
US6201266A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1999 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Dec 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A densely packaged semiconductor device includes a first semiconductor device having a plurality of bumps which are formed on a backside surface thereof, and a second semiconductor device having a plurality of terminals which are formed on the front surface thereof and which are to be electrically connected with bumps. The second semiconductor device is mounted on an area which is located on the backside surface of the first semiconductor device, the area having no bumps formed therein. The height of the second semiconductor device measured from the backside surface of the first semiconductor device is less than the height of the bumps. The second semiconductor device is mounted on the first semiconductor device such that the surface of the second semiconductor device provided with no terminals is joined to the backside surface of the first semiconductor device with an adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.