Sensor with diaphragm sensor chip
US6201285A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1999 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Dec 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An acceleration sensor with a diaphragm sensor chip has lead frames. One of the lead frames has a die pad. The sensor chip is flexibly adhered to the die pad by adhesive. The sensor chip has a diaphragm. The sensor chip outputs signals in accordance with flexure of the diaphragm. The lead frames are molded by a mold member. The mold member define a space about the sensor chip. The coefficient of linear expansion of the mold member is between 1.4.times.10.sup.-5 /.degree. C. and 1.8.times.10.sup.-5 /.degree. C., and the modulus of elasticity of the mold member is between 100.times.10.sup.3 kg/cm.sup.2 and 130.times.10.sup.3 kg/cm.sup.2. Use of the mold member minimizes the ratio of change of sensitivity due to temperature changes, which improves the temperature characteristics of the sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.