Compensation structure for a bond wire at high frequency operation
US6201454A · kind A · utility
35Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1999 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Mar 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved frequency response for a bond wire (1) at high frequency operation is realized by using a matching element (13) including a meander line (9) structure. The frequency response is improved at an operating frequency by design. The matching element (13) compensates the bond wire (1) by tuning it as a length of high impedance transmission line and then completing the combined length of the bond wire (1) and matching element (13) to a length of half of a guided wavelength at the operating frequency
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.