Method for manufacturing magnetic head suspension assembly with head IC chip
US6202288A · kind A · utility
19Cited by
5References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1999 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | Aug 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a magnetic head suspension assembly includes a step of forming a plurality of flexure pieces coupled with each other and kept substantially flat, each of the flexure pieces being provided with conductive connection pattern, a step of mounting head IC chips on the respective substantially flat flexure pieces, the mounting being executed before fixing of said flexure pieces to load beams, and a step of separating said flexure pieces with the head IC chips into individual pieces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.