Manufacturing process of thin film magnetic head sliders
US6202289A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1999 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | Jun 14, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49046
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method that can manufacture small thin film magnetic head sliders with high dimensional accuracy and high manufacturing yield is disclosed. This manufacturing method uses 5 inch- or 6 inch-dia. substrate wafers having a thickness sufficient to keep wafer bending to a minimum level even after thin film magnetic head elements have been formed on it. On the front side surface of the substrate wafer formed are thin film magnetic elements. After a protective layer covered on the surface of the thin film magnetic head elements has been ground and/or lapped, the back side surface of the substrate wafer is ground and/or lapped to a thickness equal to a desired slider length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.