Patent · US Expired

Apparatus including a heat-dissipating apparatus, and method for forming same

US6202739A · kind A · utility

65Cited by

14References

2Claims

0Family size

Assignee

Motorola, Inc. · US

Inventors

Debabrata Pal · Hoffman Estates, US
Kevin J. McDunn · Lake in the Hills, US

Key dates

Filing date	Nov 25, 1998
Grant date	Mar 20, 2001
Priority date	—
Expiry date	Nov 25, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention provides an apparatus (200) that includes a heat-generating component (202) and a heat-dissipating apparatus (120). The heat-generating component (202) is mounted on a substrate (204). The heat-dissipating apparatus (120) includes a housing piece (100) that includes a sealed chamber (102) and a phase change material (106) disposed within the sealed chamber (102). The heat-dissipating apparatus (120) is thermally coupled to the heat-generating component (202) and provides for heat dissipation by an endothermic process of changing phase from solid to liquid, thereby lowering the operating temperature of the heat-generating component (202).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.