Secondary processing for electrical or mechanical components molded to continuous carrier supports
US6202853A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 1999 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | May 25, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0084
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A new continuous carrier for surface mount or other electrical or mechanical parts, and a method of fabricating same, formed by molding one or a pair of continuous flexible film strips to a side or sides of a series of desired electrical or mechanical components such that the components are attached to the single strip or filament or suspended between the film strips or filaments. Following the initial molding step, the components, while still supported by the film strips or filament, are subjected to secondary processing Examples are: providing electrically-conductive coatings on the component throughout or selectively, providing electrically-conductive traces on the moldings, or molding in a second molding stage a part of a different composition or shape to the initial molded part. The film stips may be provided with sprocket holes or other equivalent structure for advancing the film strips during the molding process and for reeling up the result assembly onto a reel for sale or distribution to a PCB assembler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.