Co-processing of adhesive curing and solder reflow in an electronic assembly operation
US6202917A · kind A · utility
14Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1998 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | Aug 19, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic assembly is fabricated by tinning a solder to the electrical bonding pads of a printed circuit board, and applying an adhesive, preferably a filled polyurethane adhesive, to the component that is to be bonded to the printed circuit board. The component is contacted to its bonding location on the printed circuit board, and the electrical contact on the component is contacted to the tinned bonding pads. The assembly is heated in a single solder temperature/time reflow cycle to simultaneously cure the adhesive and solder the electrical contacts to the bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.