Patent · US Expired

Method of producing a thin-film platinum temperature-sensitive resistor for a thin-film microstructure sensor

US6203673A · kind A · utility

10Cited by
10References
3Claims
0Family size

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Key dates

Filing dateNov 30, 1999
Grant dateMar 20, 2001
Priority date
Expiry dateNov 30, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2224/48091
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A thin-film microstructure sensor includes a substrate having an insulation layer. A thin-film platinum temperature-sensitive resistor is provided on the insulation layer of the substrate, the thin-film platinum temperature-sensitive resistor comprising a platinum layer, the platinum layer having a maximum crystal grain size above a reference grain size of 800 .ANG.. The thin-film platinum temperature-sensitive resistor is formed by a sputtering process to provide a temperature coefficient of resistance TCR above a reference TCR level of 3200 ppm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.