Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head
US6203685A · kind A · utility
0Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 20, 1999 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | Jan 20, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A transport system for the implementation of electrolytic deposition, coating or etching; and more particularly, an apparatus for selective electrolytic metallization and deposition utilizing a fluid head arrangement. A method is provided for making and maintaining an electrical contact with a product being processed in a transport system employed for selective electrolytic metallization and deposition, coating or etching. The method of making and maintaining an electrical contact with a product being processed may be utilizing a fluid head arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.