Reduced deformation of micromechanical devices through thermal stabilization
US6204085A · kind A · utility
39Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1999 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | Sep 8, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0169
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method and system of reducing the permanent accumulated deformation of a deflectable member of a micromechanical device through thermal stabilization. The accumulated deformation is due to the repeated bending or twisting of a flexible component of the micromechanical deice typically the repetitive deformation of a flexible hinge connecting a rigid member to substrate. After the device is fabricated, passivated (316), and packaged (322), the packaged device is baked (326) at a temperature of at least 120.degree. C. A 150.degree. C. bake for 12 to 16 hours is preferred. Lower temperatures required longer baking periods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.