Screen printable curable conductive material composition
US6204303A · kind A · utility
24Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1999 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | Sep 28, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a novel UV curable composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a UV curable acrylate material, from about 0.5% to about 15% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.