Heat sink structure adapted for use in a computer
US6205025A · kind A · utility
Inventor
Key dates
| Filing date | Jan 28, 2000 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | Jan 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink structure adapted for use in a computer housing includes a thin plate of metal mounted on an inner side of a light plastic computer housing. A clearance is confined between the plate and the computer housing. The plate is connected to a main board disposed above. A heat sink element of a central processing unit on the main board has at least one heat pipe connected to the plate to dissipate heat in the computer housing via the plate. The computer housing is further provided with a fan to guide hot air out. The plate is formed with air vents to enhance air circulation or is provided with ribs to enhance heat dissipation. The plate is preferably formed from copper or aluminum that has good heat conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.