Spray cooling system
US6205799A · kind A · utility
64Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1999 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Sep 13, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roil bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.