Compact avionics-pod-cooling unit thermal control method and apparatus
US6205803A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 26, 1996 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Apr 26, 2016 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B39/04
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal control method and apparatus flows refrigerant of a vapor compression system through a plate of an avionics pod so as to provide a compact and efficient cooling technique for aircraft performing a variety of missions. The plate can serve as an evaporator in a heat pump loop or a heat exchanger in a pumped coolant loop. As a result, the same components can be used for convection cooling and compressor-assisted cooling. At lower temperatures, the pump is operational whereas under less favorable conditions the compressor is operable. A bypass can be provided to provide thermal control where ambient temperature is excessively low. A water boiler can also be utilized when, for short periods, the ambient temperature is higher than the desired temperature for the electronics package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.