Direct-placement fluxless soldering using inert gas environment
US6206276A · kind A · utility
0Cited by
26References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1999 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Sep 13, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for providing fluxless soldering without oxide formation includes mounting a component on a pedestal of a base. A housing is also mounted on the base, the housing and the base together define a closed cavity containing the component. An inert gas is introduced into the cavity to create an inert gas-rich environment. Thereafter, the cavity is heated sufficiently to reflow solder provided between the component and the housing, to join the component to the housing without the formation of additional oxides on the solder joint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.