Three-dimensional modular electronic interconnection system
US6206705A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1998 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Oct 1, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/714
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A three-dimensional connection system uses a plurality of printed wiring boards with connectors completely around the printed wiring boards, and connected by an elastomeric interface connector. The device includes internal space to allow room for circuitry. The device is formed by stacking an electronics module, an elastomeric interface board on the electronics module such that the interface board's exterior makes electrical connection with the connectors around the perimeter of the interface board, but the internal portion is open to allow room for the electrical devices on the printed wiring board. A plurality of these devices are stacked between a top stiffener and a bottom device, and held into place by alignment elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.