Through via plate electrical connector and method of manufacture thereof
US6206708A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2000 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Jan 13, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/931
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
For use with a plate having a via located therethrough an electrical connector configured to transfer an electrical signal from one major surface of a plate to the other major surface, a method of manufacturing the electrical connector and a board mounted power supply utilizing the same. In one embodiment, the electrical connector comprises a dielectric layer coating a peripheral wall of the via and extending therefrom to coat portions of the opposing major surfaces of the plate adjacent the via. The electrical connector further comprises a conductive contact layer that covers a portion of the dielectric layer and extends to portions of the opposing major surfaces to form opposing contacts thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.