Thermoplastic compound for filling pores in wooden materials

US6207289A · kind A · utility

Assignees

• Henkel Kommanditgesellschaft auf Aktien · DE
• Huels Aktiengesellschaft · DE

Inventors

• Horst Hoffmann · Pentling, DE
• Jutta Stiehl · Dresden, DE
• Dirk Hoppe · Nottuln, DE

Key dates

• Filing date: Jan 22, 1999
• Grant date: Mar 27, 2001
• Expiry date: Jan 22, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/3179
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A thermoplastic compound useful in filling pores and voids in wooden materials, particularly edge regions, wherein the thermoplastic compound comprises a blend of two copolyesters and optionally fillers, wherein the first copolyester has a melting point of 140.degree. C. to 260.degree. C. and a glass transition temperature of -10.degree. C. to 80.degree. C., and wherein the second copolyester has a melting point of 120.degree. C. to 190.degree. C. and a glass transition temperature of -70.degree. C. to 10.degree. C. Also, a method of filling pores in a wooden material comprising using a thermoplastic compound having a softening point of 140.degree. C. to 200.degree. C., an open time of 2 to 15 seconds, and a viscosity number of 30 to 150 ml/g, with the thermoplastic compound preferably being a blend of two different copolyesters, wherein the application of such thermoplastic compounds enable the surfaces of chipboard panels and the like to be smoothed in a continuous one-pass process. In particular, immediate aftertreatment such as milling is possible through the use of the thermoplastic compounds.