Soldering paste for producing geometrical metal structures with precise contours

US6207300A · kind A · utility

Assignees

• Federal-Mogul Sealing Systems GmbH · DE
• Degussa-Huels AG · DE

Inventors

• Jurgen Koch · Refrath, DE
• Manfred Koschlig · Aschaffenburg, DE
• Harald Krappitz · Kirchheim unter Teck, DE
• Wolfgang Weber · Hemau, DE
• Klaus Lonne · Burscheid, DE
• Klaus Schmitt · Wiesbaden, DE

Key dates

• Filing date: Dec 8, 1999
• Grant date: Mar 27, 2001
• Expiry date: Dec 8, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/12944
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A process for producing, on a metallic substrate, a geometric metal structure having a precise contour, including the steps of: solder coating a solder paste onto the substrate by screen printing to create the geometric metal structure, the solder paste comprising an organic binder system, and 80 to 95 weight % of a mixture of a nickel-based solder and a pulverulent alloy of nickel with at least one member selected from the group consisting of chromium, molybdenum, tungsten, manganese and iron, provided as a higher-melting metallic filler, wherein a weight ratio of solder to filler is 2-6:1, an average grain size of the solder is between 10 and 50 .mu.m, and a grain size ratio of solder to filler, relative to the average grain size is from 0.5-2.5:1; drying the structure; decomposing the organic binder system present in the solder paste, without leaving a reside, by a heat treatment; and raising the temperature until the resulting solder material liquifies.