Patent · US Expired

Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-range

US6207732A · kind A · utility

0Cited by

2References

16Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Klaus Hoehn · Taufkirchen, DE
Heiner Bayer · Olching, DE
Martin Honsberg-Riedl · Teisendorf, DE

Key dates

Filing date	Jan 19, 1999
Grant date	Mar 27, 2001
Priority date	—
Expiry date	Jan 19, 2019

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/07802
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention relates to a single-component adhesive system that consists at least of a casting resin, in particular of an epoxy casting resin, and a multivalent alcohol. The low-viscosity adhesive system can be microdosed, is stable in storage, is completely hardenable and is suitable for applications in which the dimensional tolerances are in the .mu.m and sub-.mu.m region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.