Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
US6208021A · kind A · utility
178Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1997 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Feb 26, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin sealing type semiconductor device, a manufacturing method thereof and a packaging structure thereof are capable of downsizing the semiconductor device and attaining high-density packaging. For this, the resin sealing type semiconductor device with leads exposed in an outer surface, is provided with spot leads adhered to a circuit forming surface of a semiconductor element with an insulating adhesive tape interposed therebetween, each independently regularly arrayed, and exposed to outside with the semiconductor element disposed inside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.