Method of and apparatus for bonding light-emitting element
US6208419A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1999 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Nov 10, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bonding apparatus has a probe for causing an LED chip to emit light before the LED chip is bonded on a board, an imaging system for recognizing the center of a light-emitting area of the LED chip and recognizing coordinates of a contour reference point of the LED chip with respect to the recognized center of the light-emitting area, and a light-emitting-element holding mechanism for positioning the LED chip in a bonding position on the board based on the recognized coordinates of the contour reference point. The center of the light-emitting area of the LED chip can be positioned highly accurately in a desired position on the board without being adversely affected by variations in the contour dimensions of the LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.