Heat sink
US6208517A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 1999 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Sep 10, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink includes mounting feet, a plurality of folds, and a clip. Each of the folds has a base portion, and the clip couples at least two of the folds together to inhibit fanning in at least a contact region defined by adjacent base portions. An apparatus includes a printed circuit board, mounting receptacles on the printed circuit board, a heat sink, and a device package. The heat sink includes feet adapted to interface with the mounting receptacles, a plurality of folds, and a base portion defined between the folds. The device package is coupled to the printed circuit board. The base portion of the heat sink contacts at least a portion of the device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.