Film carrier and laminate type mounting structure using same
US6208521A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 19, 1998 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | May 19, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/189
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A film carrier to be used for fabricating a new laminate type mounting structure, a new laminate type mounting structure comprising semiconductor elements mounted on the film carrier of the present invention and the laminate type mounting structure comprising a heat-releasing structure are provided. Due to the invention of the film carrier, handling of the semiconductor elements as well as fabrication of a laminate type mounting structure are facilitated. When a heat-releasing structure is added, the laminate type mounting structure of the present invention can advantageously efficiently release the heat generated by the semiconductor element in each layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.