Thermal management apparatus for a sealed enclosure
US6209631A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 23, 1999 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | Jul 23, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05D23/1909
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Apparatus (30) controlling the temperature within a sealed enclosure (10) housing electronic components (E) whose operation produces heat, and whose operation should occur within a desired temperature range. A heat sink (32) extending through an enclosure endwall (14) conducts heat from within the enclosure to the atmosphere. Other heat sinks (40) mounted within the enclosure are in a thermal transfer relationship with the components for heat generated by the components to be drawn to the heat sinks away from the components. A heat pipe (50) extending between the respective heat sinks conducts the heat to the first said heat sink for heat to be expelled from inside the enclosure to the atmosphere. A heater (60, 62) within the enclosure generates heat to heat the components, and a thermostat (72, 74) senses when the temperature within the enclosure falls below a predetermined temperature to energize the heater. Heater is sized to cause a "dry out", condition in the heat pipe when the thermostat energizes the heater. As a result, the temperature in the enclosure is maintained within the desired range by appropriately removing heat, from or generating heat within, the enclosure and co…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.