Patent · US Expired

Data medium in card form and lead frame for use in such a data medium

US6209790A · kind A · utility

23Cited by

12References

5Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Detlef Houdeau · Langquaid, DE
Josef Kirschbauer · Blaibach, DE
Christoph Filser · Buchloe, DE

Key dates

Filing date	Sep 26, 1997
Grant date	Apr 3, 2001
Priority date	—
Expiry date	Sep 26, 2017

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49119
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A data medium in card form has a least one semiconductor memory element with a storage capacity of at least one megabit and has electroplated contacts for transmission of data between a data processing system the semiconductor memory elements of the data medium. Electrical conductor paths on the data medium connect the semiconductor memory element to the electroplated contacts. The electrical conductor paths are a single leadframe on which at least parts of the electroplated contacts are integrally formed. The leadframe is formed of a resilient material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.