Thin film structure machining and attachment
US6210514A · kind A · utility
44Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 1998 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | Feb 11, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/108
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Batch fabrication of thin film structures can be facilitated by sandwiching a thin film between a first and a second polymeric or elastomeric layers. The sandwiched layer can be machined to define a thin film structure, typically a micoroelectromechanical element. This element is separated from the sandwiching layers by adhesive attachment to a target substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.