Dimensionally stable thermoplastic moulding materials
US6211266A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2000 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | May 11, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L25/12
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic molding compositions comprise PA1 A) from 10 to 97.9% by weight of a partly crystalline polyamide, PA1 B) from 0.1 to 50% by weight of a copolyamide composed of PA2 B.sub.1) from 60 to 90 mol % of units derived from s-caprolactam and PA2 B.sub.2) from 10 to 40 mol % of units derived from aliphatic dicarboxylic acids and from aliphatic diamines, PA1 C) from 1 to 40% by weight of a copolymer based on styrene or on substituted styrenes and on unsaturated nitriles, PA1 D) from 1 to 50% by weight of a fibrous filler and PA1 E) from 0 to 30% by weight of other additives, where the percentages by weight of components A) to E) are 100% in total.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.