Patent · US Expired

Dimensionally stable thermoplastic moulding materials

US6211266A · kind A · utility

2Cited by
1References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 11, 2000
Grant dateApr 3, 2001
Priority date
Expiry dateMay 11, 2020

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L25/12
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Thermoplastic molding compositions comprise PA1 A) from 10 to 97.9% by weight of a partly crystalline polyamide, PA1 B) from 0.1 to 50% by weight of a copolyamide composed of PA2 B.sub.1) from 60 to 90 mol % of units derived from s-caprolactam and PA2 B.sub.2) from 10 to 40 mol % of units derived from aliphatic dicarboxylic acids and from aliphatic diamines, PA1 C) from 1 to 40% by weight of a copolymer based on styrene or on substituted styrenes and on unsaturated nitriles, PA1 D) from 1 to 50% by weight of a fibrous filler and PA1 E) from 0 to 30% by weight of other additives, where the percentages by weight of components A) to E) are 100% in total.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.