Polyoxymethylene resin composition
US6211268A · kind A · utility
14Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 1999 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | May 7, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyoxymethylene resin composition comprising: PA1 (A) 100 parts by weight of a polyoxymethylene copolymer; PA1 (B) 0.01 to 7 parts by weight of an amine-substituted triazine compound; and PA1 (C) 0.01 to 5 parts by weight of (C-1) polyethylene glycol having an average molecular weight of 10,000 or more and/or (C-2) modified polyolefin wax having an acidic group with an acid value of 0.5 to 60 mg-KOH/g. According to the present invention, there can be provided a polyoxymethylene resin molded product which has low shrink anisotropy, excellent thermal stability and dimensional stability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.