Electronics package on a plate, and a method of making such a package
US6212072A · kind A · utility
3Cited by
14References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2000 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | May 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48472
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic package has a plate of aluminum or aluminum alloy supporting electronic microcomponents. Trenches, and possibly cavities, are formed on a major surface of the plate. An insulating oxide layer covers the major surface, including the trenches and cavities. A network of equipotential electrically conductive connection tracks are formed on the major surfaces and receive contacts of the electronic microcomponents. Some tracks are above the trenches and thicker than the others.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.